ABOUT

TF-FAB is a dual chamber magnetron sputtering system with interconnecting load loack. A general overview is shown below.

Common characteristics include 6” susbtrate handling, 800C substrate heater, 2x quartz crystal monitor per chamber, 4x 3” magnetron sources (sputter up) and 3x dedicated lines for processing gases (argon, nitrogen and oxygen). Each chamber has 4 dedicated power supply  which can be connected to any source in that chamber. The system comes with a 6-wavelength ellipsometer to monitor the growing films. The ellispometer can mounted on either chamber for in-situ monitoring but can also be used ex-situ with a dedicated platform. Further chamber specific specifications include:

Process chamber 1 (LHS, PC1): 1 x RF, 2 x DC and 1 x p-DC power power supplies, RF substrate biasing with the source power supply, glancing angle holder insert to grow nanostructures.

Process chamber 2 (RHS, PC2): 1 x DC, 2 x p-DC and 1 x HiPIMS power supplies. RF and DC susbtrate biasing via dedicated power supplies. A 4th gas line is included for gas injection close to the target for light element doping.